Improved Photoresist Coating for Making CNT Field Emitters
NASA’s Jet Propulsion Laboratory
Sunday, February 01 2009
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This technique could contribute to development of cold cathodes for diverse applications.
An improved photoresist-coating technique
has been developed for use in the
fabrication of carbon-nanotube- (CNT)-
based field emitters of the type described
in “Fabrication of Improved Carbon-
Nanotube Field Emitters” (npo-44996),
NASA Tech Briefs, Vol. 32, No. 4 (April
2008), page 50. The improved photoresist-
coating technique overcomes what,
heretofore, has been a major difficulty in
the fabrication process. This technique is
expected to contribute to the realization
of high-efficiency field emitters (cold
cathodes) for diverse systems and devices
that could include gas-ionization systems,
klystrons, flat-panel display devices, cathode-ray tubes, scanning electron microscopes,
and x-ray tubes.
Figure 1. A CNT-Based Field Emitter of the type to which the present innovation applies includes a gate electrode that overhangs a recess containing an array of bundles of carbon nanotubes. For the sake of clarity, this drawing is simplified and not to scale.
To recapitulate from the cited prior
article: One major element of the device
design is to use a planar array of bundles
of carbon nanotubes as the field-emission
tips and to optimize the critical
dimensions of the array (principally,
heights of bundles and distances
between them) to obtain high area-averaged
current density and high reliability
over a long operational lifetime.
Another major element of the design is
to configure the gate electrode (an
anode used to generate the electron-emitting
and -accelerating electric field)
as a ring that overhangs a recess wherein
the bundles of nanotubes are located
(see Figure 1), such that by virtue of the
proximity between the ring and the bundles,
a relatively low applied potential
suffices to generate the large electric
field needed for emission of electrons.
Figure 2. Holes To Define Catalyst Dots were formed in a photoresist membrane bridging a recess like that of Figure 1. This scanning electron micrograph was recorded at tilt angle of 20° to make the slight bulge of the membrane more visible.
The major difficulty in the fabrication
process as practiced before the development
of the improved photoresist-coating
technique arises in the step immediately
after the formation of the overhang and the
recess. In this step, it is necessary to spin-coat
the flat bottom surface of the recess
with a uniform layer of a photoresist that is
to be patterned with holes in a subsequent
photolithographic step. The patterned
photoresist is then to be used in subsequent
deposition and liftoff steps to form dots of a
catalytic material, about 2 μm in diameter
and spaced about 5 μm apart, upon which
the bundles of CNTs are to be grown. The
difficulty is caused by a combination of the
dimensions of the recess and overhang, the
surface tension and viscosity of the photoresist
solution, and the centrifugal force associated
with spin coating. The net effect is
that it becomes difficult or impossible to
make the photoresist solution flow into or
out of the recess and, hence, difficult or
impossible to coat the bottom of the
recess to the required uniform thickness.
Often, the photoresist solution bridges
over the recess.
The concept underlying the improved
photoresist-coating technique is to turn
the source of difficulty to advantage. In
this technique, one does not attempt to
make the photoresist solution flow into
the recess: Instead, the photoresist solution
and spin-coating conditions are chosen
to maximize the tendency of the photoresist
solution to become formed into a
uniform-thickness membrane bridge
over the recess. After spin coating, the
workpiece is subjected to a soft bake in
which the air trapped in the recess
expands, causing the photoresist membrane
to acquire an outward bulge
between 5 and 10 μm. The bake solidifies
the membrane, which thereafter retains
the bulge. Then the pattern of holes is
formed on the photoresist membrane
bridge (see Figure 2). Experiments have
confirmed that the patterned membrane
bridge can be used to form the corresponding
pattern of dots of catalytic
material on the flat bottom surface of the
recess and that the bundles of carbon
nanotubes can be grown on these dots.
This work was done by Risaku Toda and
Harish Manohara of Caltech for NASA’s Jet
Propulsion Laboratory.
In accordance with Public Law 96-517,
the contractor has elected to retain title to this
invention. Inquiries concerning rights for its
commercial use should be addressed to:
Innovative Technology Assets Management
JPL
Mail Stop 202-233
4800 Oak Grove Drive
Pasadena, CA 91109-8099
E-mail:
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Refer to NPO-45624, volume and number
of this NASA Tech Briefs issue, and the
page number.
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