
A new thermometer design uses multiple
RuO2 chip resistors and off-theshelf
bobbins. The chips would be configured
in an array to spread the heat
over a greater area during excitation. A
technique was developed to connect
the chips together, first in a 2×2 array,
and finally in a 3×3 array. The 3×3 array
configuration of the RuO2 chips allows
better internal heat distribution than a
single chip, thereby reducing self-heating.
The uniqueness of this design is in
the array configuration, which allows
greater sensitivity at ultralow temperatures
while keeping a small package
footprint [about 0.4 in. (10 mm)]. The
device uses a standard round bobbin
with a #4 screw through-hole.
This work was done by Thomas Hait, Peter J. Shirron, and Michael DiPirro of Goddard Space Flight Center. For further information, contact the Goddard Innovative Partnerships Office at (301) 286-5810. GSC-15690-1