Cooling Embedded Systems What Are The Options?

As the cooling challenges in embedded system applications have multiplied due to increased processing performance, smaller package and system footprints, and the requirement to operate in more rugged environments, new thermal management options and industry standards continue to evolve. Designers of systems for these markets, and especially those in remote or rugged, 24/7 operating environments, have always had to make difficult decisions regarding lifespan, reliability, and cost.

But what is the best thermal management cooling option for a particular application? To assist with the selection process, it is helpful to understand the four primary cooling methods used in embedded systems: onboard fans, passive cooling with system fans, conduction cooling, and fanless convection cooling. While some applications depend on industry standards that address cooling concerns in their basic specification, others benefit from a variety of component building blocks to achieve cost-effective resolution of thermal management issues.

Understanding Your Options

The thermal management method used depends entirely upon the application and the individual devices designed into the system. Applying knowledge of the application devices along with a thorough analysis of the thermal makeup of a particular application, designers can more easily match the optimal cooling option. Below is an overview of the main electronics cooling options. Examples of typical usage of each cooling option are presented in the accompanying table.

Onboard Fans: By far the most popular method of thermal management is the use of onboard or passive cooling fans somewhere in the embedded design. Fans are also one of the most cost-efficient options for system cooling.