Alumina Paste Layer as a Sublimation Suppression Barrier for Yb₁₄MnSb₁₁

This material can be applied to any thermoelectric couples requiring sublimation suppression.

Sublimation is a major cause of degradation of thermoelectric power generation systems. Most thermoelectric materials tend to have peak values at the temperature where sublimation occurs. A sublimation barrier is needed that is stable at operating temperatures, inert against thermoelectric materials, and able to withstand thermal cycling stress.