| Potting and Encapsulation UV Adhesive |
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| May 01 2008 | |
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Master Bond (Hackensack, NJ) has introduced Master Bond UV10SP-2A, a one-component, flexible, UV curable polymer system for bonding, sealing, and coating with an attractive balance of pertinent physical, electrical, and chemical properties. The 100% reactive, moderate viscosity liquid at ambient temperatures does not contain any solvents or other volatiles. When exposed to a UV light source, Master Bond Polymer System UV10SP-2A cures as a durable, tough, non-yellowing system that can be used as an adhesive, sealant, and coating. Maximum absorption of UV energy takes place in the 250-365 nanometer range. The cured coatings, adhesives, and sealants can be used over a wide temperature range of -60°F to +250°F. The UV10SP-2A is not oxygen inhibited and exhibits a fast curing rate at ambient temperatures even in the presence of air. The polymer system can be cured in section thickness up to 1/8 in. deep, making it of value for various electronic and opto-electronic potting and encapsulation applications. The UV10SP-2A has a high flexibility, which imparts vibration and shock resistance as well as superior ability to withstand thermal cycling and thermal shock. UV10SP-2A is also a re-workable compound.For Free Info, click here |
