Embedded Technology - Motion-SPM Devices in SMD Packaging Optimize Board Space

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Motion-SPM Devices in SMD Packaging Optimize Board Space

Jan 01 2007

Fairchild Semiconductor (South Portland, ME) has introduced the FSB50325S (250V), the FSB50250S (500V), and the FSB50450S (500V) Motion-SPM™ devices available in 29 × 12-mm surface-mount-device (SMD) packages. The Motion-SPM in SMD enables designers to achieve energy efficiency, compactness, and low electromagnetic interference (EMI) required by small inverter motor drive applications such as water pumps and fan motors.

The SMD packaging provides a highisolation voltage rating of 1500 Vrms for one minute, and thermal resistance. The ultra-small size is suited for spaceconstrained applications, allowing designers to utilize the back side of the PCB where the module is mounted. Each Motion-SPM integrates six fast-recovery MOSFETs (FRFET™) and three halfbridge, high-voltage ICs (HVIC) into one package. These integrated components result in low-loss and low EMI characteristics. By employing a MOSFET as the device’s power switch, the Motion-SPM also provides system ruggedness and a larger safe operating area (SOA) than either IGBT-based power modules or onechip devices.

For Free Info Visit http://info.hotims.com/10960-414

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