MicroTCA is a new specification that offers very high performance packed in a small form factor. The new specification is expected to be used in a wide variety of applications, including mil/aero, telecom edge, medical, enterprise and data, and scientific applications. However, there are so many possible configurations, it can be overwhelming. How can one develop various systems and offerings without starting from scratch — and the time to market, high costs, and implementation issues this brings? One solution is using modularity in MicroTCA designs. Prototyping and development of a new system enclosure design can be a time-consuming and costly process. Building upon a proven modular platform allows a wide range of design options with significantly reduced effort.

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MicroTCA can come in a wide number of configurations, including single (75-mm high) or double (150-mm high) modules, in compact, mid-, or full-size. Further, pico, cube, or subrack chassis formats are all possibilities (see Figure 1). The MicroTCA standard was developed with stamped sheet metal enclosures in mind, which is attractive for high volumes, but what about new product development, prototyping, and small-to-medium volumes? The strength of MicroTCA is its flexibility, and that flexibility requires the designer to make a lot of choices. Depending on his exact design criteria, it could be difficult to build and optimize a backplane design without the time and expense of heavy customization. All sheet metal parts need to be drawn and these parts are quite complex. Furthermore, a flat pattern and a punching program have to be created. Modular enclosures designed specifically for MicroTCA can solve this problem.