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Jeovanny Sanchez
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May 01 2007 |
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Flomerics, Inc. (Marlborough, MA) released the Flopack V6.2 version of its Web-based SmartPart library that generates thermal models for IC packages, standard test harnesses, and associated parts.
Thermal models created with the software can be imported into Flomerics’ Flotherm or FloPCB to analyze the cooling requirements of electronic components, boards, and systems. Features include a model for bond-wires; an expansion of the power/discrete semiconductor package library; and a parametric rules engine that checks for errors in design data inputs. A set of sanity checks has been implemented directly at the design sheet level. There also is an underfill option for two-resistor model calculation. The software may be used to predict junction and case temperatures of IC components accurately in users’ designs, and can communicate thermal information to external vendors or customers in a standardized manner. Thermal libraries can be shared and archived within an organization using the workgroup features. For Free Info Visit http://info.hotims.com/10968-417 |
